Journal papers comparing ANSYS solutions to experiments:

Design, optimization and simulation on microelectromagnetic pump
Gong QL, Zhou ZY, Yang YH, Wang XH
SENSORS AND ACTUATORS A-PHYSICAL

83: (1-3) 200-207 MAY 22 2000

Abstract:
A four-layer electromagnetic micropump was designed, and its static and dynamic characters were studied from elements to full system. The mechanical model of the electromagnetic actuator was established, and some its geometric structural parameters were then optimized. The deflection of the pump membrane caused by the varying local magnetic driving forces was analyzed in particular by ANSYS FEM. Fluid theory and experiment data were used to analyze the microvalve. Full system model of the micropump and its differential equations were set up on the basis of physical liquid transmission procedure and system function block. Pulse and periodic pulse driving current responses were evaluated. The flow-frequency characteristic shows that the most effective driving frequency is 125 Hz. The effect of driving signal duty cycle and microvalve flow resistance was studied. The transfer function of this full system of micropump was also discussed. (C) 2000 Elsevier Science S.A. All rights reserved.

Finite element analysis for the semi-solid state forming of aluminium alloy considering induction heating
Ko DC, Min GS, Kim BM, Choi JC
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY

100: (1-3) 95-104 APR 3 2000

Abstract:
The major objective of this study is to establish an analytical technique in order to investigate the behavior of semi-solid material considering induction heating of the workpiece. The induction heating process is analyzed using the commercial finite element software, ANSYS. The finite element program, SFAC2D, for the simulation of deformation in the semi-solid state is developed in the present study. The behavior of semi-solid material is described by a viscoplastic model for the solid phase and by Darcy's law for the liquid flow. Simple compression and closed-die compression processes considering induction heating are analyzed. To validate the effectiveness of the proposed analytical technique, the results of simulation are compared with those of experiment. (C) 2000 Elsevier Science S.A. All rights reserved.

Optimization of high pin count cavity up enhanced plastic ball grid array (EPBGA) packages for robust design
Mertol A
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING

20: (4) 376-388 NOV 1997

Abstract:
Three-dimensional (3-D) nonlinear finite element models of epoxy encapsulated enhanced plastic ball grid array (EPBGA) packages with and without an aluminum lid have been developed using ANSYS finite element simulation code [1]. The model has been used to optimize the packages for robust design and to determine design rules to keep package warpage within acceptable limits. An L-18 Taguchi matrix has been developed to investigate the effect of die attach and encapsulant properties along with the substrate, encapsulant, die attach, and internal copper plane thicknesses on the reliability of the package during temperature cycling. For package failures, simulations performed represent temperature cycling from 165 degrees C to -65 degrees C. This condition is approximated by cooling the package mounted on a multilayer printed circuit board (PCB) from 165 degrees C to -65 degrees C, For coplanarity analysis, simulations have been performed without the PCB and the lowest temperature of the cycle is changed to 20 degrees C.

Predicted results indicate that for an optimum design, that is low stress in the package and low package warpage, encapsulant as well as die attach material should have low Young's modulus and low coefficient of thermal expansion. Furthermore, it is found that the substrate and the die attach epoxy thicknesses should be increased beyond the current design. In addition to the optimization analysis, plastic strain distribution on each solder ball has been determined to predict the location of the possible first solder ball failure. The results indicate that higher strain levels are attained in solder balls underneath the die region. Even if there were any solder ball failures in that region it would not affect the functionality of the package since the solder balls in that region are used only for thermal enhancement of the package. For the package with an aluminum lid, although significantly higher solder ball strain is observed at the dam ring location, the magnitudes are still much lower than the ones observed underneath the die region.

FINITE-ELEMENT ANALYSIS OF THE TPX TOROIDAL FIELD-COIL SYSTEM
MYATT RL
IEEE TRANSACTIONS ON MAGNETICS

30: (4) 2082-2085, Part 2 JUL 1994

Abstract:
A structural analysis of the Tokamak Physics Experiment (TPX) toroidal field (TF) coil system is presented. The large-scale structural behavior of the superconducting 16-coil magnet is simulated with a 3-D, cyclically-symmetric, two-coil, ANSYS [1] model. The computer model is used to determine the displacement and stress state of the smeared winding pack and support structure, and to perform various structural evaluations. Approximating the detailed stresses in the winding pack constituents based on smeared stress results and analytically derived component stress multipliers is discussed. The effectiveness of friction between wedged TF cases to help restrain out-of-plane electromagnetic forces is also considered. A stress evaluation of the conductor, insulation and structure is presented based on the TPX structural design criteria.

BEHAVIOR OF A DC ZERO-FLUX CURRENT SENSOR - MAGNETIC-FIELD ANALYSIS AND COMPARISON WITH EXPERIMENTAL RESULTS
CAMPOSTRINI P, SONATO P
IEEE TRANSACTIONS ON MAGNETICS

27: (5) 3923-3926 SEP 1991

Abstract:
The magnetic section of the finite-element ANSYS(R) code, and in particular its optimization feature has been used to predict the behaviour of a zero-flux current sensor, briefly described, which is intended to be used in a fusion experiment to measure pulsed currents up to 50 kA, over a bandwidth from DC to 10 kHz. The computed results fit well with those coming from experimental tests performed on a prototype.

ADVANCED CONCEPTS IN MECHANICAL DESIGN AND COMPUTERIZED CONTROL-SYSTEM FOR A HYBRID PERMANENT-MAGNET UNDULATOR
BARBAGELATA L, GRATTAROLA M, MATRONE A, OTTONELLO G, ROSATELLI F, CIOCCI F, GALLERANO G, RENIERI A, SABIA E
NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION A-ACCELERATORS SPECTROMETERS DETECTORS AND ASSOCIATED EQUIPMENT

304: (1-3) 703-706 JUL 1 1991

Abstract:
A 50 periods long hybrid permanent magnet undulator is being realized at Ansaldo Ricerche for the LISA FEL experiment of the INFN, Frascati, Italy [1]. An innovative design of the mechanical structure and an electronic control system have been developed in order to accurately position the jaws without requiring very tight mechanical tolerances in the manufacturing of the driving components. The mechanical design has been optimized by performing an accurate structural analysis with the ANSYS code. The control system checks the parallellism between the jaws during the gap variation and restores it automatically. Besides, it changes the current of the correction coils to minimize the dipole field integral at each gap. The security system to guarantee the safe operation of the device is also described.